AI #Stock News: GBT's Patent (OTCPINK: $GTCH) for 3D Monolithic, Multi-Dimensional/Plane, Memory Structure - Integrated Circuits – Granted; @GbtTechnologies #artificialintelligence
San Diego, CA, November 24, 2020 - (Investorideas.com Newswire) GBT Technologies Inc. (OTCPINK: GTCH) ("GBT", or the "Company"), announced as continuance update to its press release from October 29, 2020, that its 3D microchip patent received a grant date as of December 1, 2020 by the United States Patent and Trademark Office (“USPTO”); U.S. Patent No. 10,854,763. The Company filed for this patent on March 5, 2019.
Read
this news, featuring GTCH in full at https://www.investorideas.com/CO/GOPH/news/2020/11241Patent-Granted.asp
The
invention relates to the field of integrated circuit (IC) silicon structure,
and more particularly to multi-dimensional, multi-planar microchips. This
patent covers GBT's futuristic integrated circuit technology which introduces
new methods for microchip's manufacturing. The concept presents a new die
structure and orientation. The Company believes that the new methods are
efficient for all manufacturing nodes and especially for deep nanometer ranges.
The technology enables the manufacturing of more transistors on a silicon wafer
in order to place more circuits/features on a die. The new manufacturing
architecture enables larger designs within smaller areas and significantly
increases the silicon yield. The invention supports analog, RF, digital, MIXED
and MEMS designs. We believe that it has the potential to revolutionize
integrated circuits manufacturing and packaging, enabling huge chips on
affordable silicon areas. It may be especially significant when it comes to
heavily area-dependent ICs, for example memory chips, MEMS
(Micro-Electro-Mechanical Systems) and micro solar cells.
When
it comes to these types of microchips, silicon area is crucial and every micron
is important. The new approach will enable the manufacturing of much larger
chips within affordable areas. A three-dimensional integrated circuit is a
metal-oxide semiconductor (MOS) integrated circuit, manufactured by stacking
silicon dies and electrically interconnecting them vertically. GBT's invention
goes beyond 3D concept with multi-plane silicon structures, for example
honeycomb, hexagonal and further multi-planetary structures, with the goal of
increasing silicon surface area. The patent covers silicon interconnection not
only vertically but in a multi planar way which opens an entire world of
possibilities maximizing silicon area. Manufacturing these types of structures
will enable the design of chips with multi-trillion transistors on die,
creating new horizons for our entire electronics world. Few examples of areas
that will be significantly enhanced are flash memories, GPUs, CPUs,
displays, micro-solar cells panels, RF, and MEMS.
"We are glad to announce that we will be granted our multi-planer
microchip patent on December 1, 2020" said Danny Rittman, GBT’s
CTO. "By manufacturing honeycomb, hexagonal and other multi planer
structural shapes die, we believe IC design houses will be able to increase their silicon surface for
transistors. Especially when it comes to memory circuits, silicon real-estate
is a key factor. As more we can place on the silicon, as better, given
reasonable, affordable die size. We believe the invention will enable to design
and manufacture gigantic chips for all design processes including advanced
nodes like 10nm, 7nm, 5nm and below. "
Forward-Looking
Statements
Certain
statements contained in this press release may
constitute "forward-looking statements". Forward-looking
statements provide current expectations of future events based on certain
assumptions and include any statement that does not directly relate to any historical or current fact. Actual results may differ
materially from those indicated by such forward-looking statements as a result
of various important factors as disclosed in our filings with the Securities
and Exchange Commission located at their website ( http://www.sec.gov).
In addition to these factors, actual future performance, outcomes, and results
may differ materially because of more general factors including (without
limitation) general industry and market conditions
and growth rates, economic conditions, governmental and public policy changes,
the Company’s ability to raise capital on acceptable terms, if at all, the
Company’s successful development of its products and the integration into its
existing products and the commercial acceptance of
the Company’s products. The forward-looking statements included in this
press release represent the Company's views as of the date of this press
release and these views could change. However, while the Company may
elect to update these forward-looking statements at
some point in the future, the Company specifically disclaims any obligation to
do so. These forward-looking statements should not be relied upon as
representing the Company's views as of any date subsequent to the date of the press release.
Contact:
Dr.
Danny Rittman, CTO
press@gopherprotocol.com
GBT Technologies
Inc. (OTCQB:GTCH) is a featured tech stock on
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